Firma i stanowisko
The company provides end-to-end ASIC and COT design and turnkey manufacturing services to fabless companies and OEMs building advanced SoCs. Its offering covers architecture, RTL-to-GDSII implementation, analog/mixed-signal design, and productization through silicon, package, and test. Working across process nodes from 180nm to 2nm, it has completed over 350 tape-outs since 1986.
Wymagania
- BSc in Electrical Engineering from a recognized university
- Minimum 3 years of hands-on DFT experience; senior-level preferred
- Experience with scan, ATPG, at-speed test, memory BIST, I/O DFT methodologies
- Knowledge of scan insertion and ATPG for stuck-at, transition-delay, bridging and IDDQ fault models
- Experience with DFT DRC analysis and coverage debug using Synopsys DFT Compiler, TestMAX (TetraMAX), SpyGlass DFT, or Siemens (Mentor) Tessent tools
- Memory BIST experience with Tessent MBIST
- Strong knowledge of JTAG IEEE 1149.1, IEEE 1149.6, and IEEE 1500 standards
- Hands-on design and implementation of DFT features
- Gate-level simulation setup and runs for pattern validation
- Formal equivalence checking
- Scripting skills in Perl, Tcl, UNIX for flow automation
Nice to have:
- Broader Siemens Tessent experience (ScanPro, TestKompress, LBIST) beyond MBIST
- Advanced-node experience (7nm and below)
- Python scripting for flow automation
Obowiązki
- Own Design-for-Test (DFT) end-to-end: concept through tape-out to production test hand-off
- Implement DFT features including scan insertion and ATPG
- Perform gate-level simulation setup and runs for pattern validation
- Conduct formal equivalence checking
- Automate flow using Perl, Tcl, and UNIX scripting
CommIT
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